PCB Manufacturing
2022-06-22 06:31:57 View：981
PCB Manufacturing
Faisemi offer PCB fabrication up to 40 Layers, including Rigid PCB, Flex PCB, Rigid-flex PCB, Aluminum-based PCB, High Frequency PCB, HDI PCB Board etc. PCB manufacturing technologies and services includes:
lRapid PCB Prototyping service
lNon plated through hole PCBs
lDouble Sided PTH PCBs
lMulti-Layer PCBs (up to 40 layers)
lSpecial laminate processing Rogers, Taconic, Nelco & Arlon
PCB Manufacturing Capabilities
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ITEM
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Capability
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Layers
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1-40
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Thicker Copper
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1-6OZ
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Products Type
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HF(High-Frequency)&(Radio Frequency) board, Impedance controlled board , HDI board ,BGA& Fine Pitch board
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Solder Mask
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Nanya&Taiyo ;LPI & Matt Red, green, yellow,white, blue,black.
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Base material
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FR4(Shengyi China、ITEQ, KB A+,HZ), HI-TG, FR06, Rogers,Taconic、Argon、Nalco、Isola and so on
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Finished Surface
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Conventional HASL,Lead-free HASL,Falsh Gold, ENIG (Immersion Gold)OSP(Entek), Immersion Tin,ImmersionSilver,Hard Gold
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Selective Surface
Treatment
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ENIG(immersion Gold)+OSP, ENIG(immersion Gold)+Gold Finger,Flash Gold +Gold Finger, immersion Silver+ Gold Finger, Immersion Tin+Gold Finger
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Technical Specification
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Minimum line width/gap:3.5/4mil(laser drill)
Minimum hole size:0.15mm(mechanical drill)/4mil(laser drill)
Minimum Annular Ring: 4mil
Max Copper thickness: 6OZ
Max Production size:900×1200mm
Board Thickness:D/S: 0.2-7.0mm, Multilayers:0.40-7.0mm,
Min Solder Mask Bridge:0.08mm
Aspect ratio: 15:1
Plugging Visa capability: 0.2-0.8mm
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Tolerance
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Plated holes Tolerance:0.08mm(min±0.05)
Non-plated hole tolerance:0.05min(min+0/-0.05mm or +0.05/-0mm)
Outline Tolerance:0.15min(min±0.10mm)
Functional test :
Insulating resistance : 50 ohms (mormality)
Peel off strength: 1.4N/mm
Thermal Stress test :2650c,20 seconds
Solder mask hardness:6H
E-Test voltage :500V+15/-0V 30S
Warp and Twist: 0.7% (semiconductor test board≤0.3% )
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